PCBA MANUFACTURING

While capabilities may vary slightly by facility, our PCBA capabilities include:

  • Low- to High-Volume Production
  • Complex Double-sided Multi-Layer PCBAs
  • Leaded and Lead-free
  • SMT
    -12m Fine Pitch
    – 0201
    – 01005
    – BGA
    – Micro-BGA
  • BGA rework
  • Through-hole
    – Auto Insertion (Axial/Radial/DIP)
  • Aqueous cleaning
  • Conformal and Parylene coating
  • Encapsulation
  • Potting
  • Test
    – AOI
    – X-ray laminography
    – Flying probe
    – Boundary scan
    – In-circuit test (ICT)
  • Functional Test
    -Stress Test
    ° HOTL/LTOL
    ° Temp Cycle
    ° 85/85
    ° Thermal Shock

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